96 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) (1.90) BOTTOM VIEW #A1 INDEX MARK MOLDING AREA #A1 INDEX MARK MOLDING AREA DDR3 SDRAM 9.00 ± 0.10 TOP VIEW 9.00 ± 0.10 TOP VIEW October 2009 0.35 ± 0.05 1.10 ± 0.10 0.35 ±...
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(Datum B) 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) Bottom #A1 INDEX MARK 10.50 ± 0.10 #A1 INDEX MARK 9.00 ± 0.10 DDR3 SDRAM 0.35 ± 0.05 1.40 ± 0.10 0.35 ± 0.05 1.40 ± 0.10 October 2009...
Green Line : TIM Attatch Line 80.78 119.29 2. BACK PART Outside Inside Green Line : TIM Attatch Line 133.15 ± 0.2 130.45 ± 0.15 29.77 31.4 ± 0.12 Reg. pedestal line 128.5 DDR3 SDRAM 0.65 ± 0.2 0.15 October 2009...
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General Information 3. CLIP PART 39.3 ± 29.77 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) * Dimension Index Min. E (Clip open size) Upper Bending Tilting Gap 0.1 ~ 0.3...